Table of Content

Advanced liquid cooling technologies use specialized designs, materials, and processes to efficiently remove heat from high-performance systems like data centers and power electronics. These technologies enhance heat transfer through direct contact cooling, phase change processes, or improved fluid dynamics, providing precise temperature control to maintain optimal operating conditions. They integrate with equipment design for better space utilization and performance, often using engineered coolants with superior thermal properties and lower electrical conductivity compared to water.

Direct-to-Chip (D2C) Cooling

• Prevalence: Moderate to High
• Description: Direct-to-Chip (D2C) cooling involves attaching cold plates directly to CPUs, GPUs, or other heat-generating components. Coolants, either in single-phase (liquid only) or two-phase (liquid to gas and back), are circulated through these cold plates to absorb and dissipate heat efficiently.
• Mechanism: In single-phase systems, the coolant absorbs heat and is recirculated without changing phase. In two-phase systems, the coolant vaporizes at high heat spots and condenses back to liquid in a cooler area of the system.
• Data Center Use: Widely adopted in data centers for high-performance computing tasks, particularly where high heat flux management is crucial.
• Benefit: Provides precise, efficient cooling directly at the heat source, reducing thermal stress and enhancing performance and longevity of critical components. Two-phase systems, in particular, handle higher heat densities effectively, allowing for closer component packing and smaller cooling infrastructure.

Figure 10: Direct to Chip Cold Plate Cooling, Source: Vertiv

Startup Example: ZutaCore

ZutaCore is a startup specializing in advanced liquid cooling solutions for data centers. The company focuses on direct-on-chip, waterless liquid cooling technology designed to manage heat efficiently and reduce cooling costs in high-density computing environments. With GPUs like the H100 and H200 consuming up to 700W each, ZutaCore's HyperCool® technology effectively dissipates heat directly at the source. This technology cools processors of 1,500 watts or more and handles 100kW per rack, increasing rack-processing density by 300%.

Technology: ZutaCore's technology includes proprietary direct-on-chip cooling solutions that leverage a two-phase, waterless liquid cooling system. This system effectively dissipates heat directly at the source, enhancing cooling efficiency and preventing hotspots.

Product Offering: ZutaCore offers a range of cooling solutions tailored for data centers, including:

• HyperCool: Direct-on-chip cooling systems designed for high-density server environments.
• HyperCool2: An advanced version with enhanced cooling capabilities and modular design for scalability.