Table of Contents:
Advanced Immersion Cooling Systems
- Prevalence: Moderate and Increasing
- Description: Enhanced immersion cooling with engineered fluids, often incorporating nanoparticles to improve thermal conductivity and heat capacity.
- Mechanism: Submerging components in advanced dielectric fluids with improved heat transfer properties.
- Use Case: Next-generation data centers, high-performance computing, and blockchain mining operations.
- Benefit: Increased cooling efficiency, reduced energy consumption, and higher component densities.
LiquidStack specializes in advanced liquid cooling solutions, focusing on two-phase immersion cooling technology. This method enhances data center efficiency by submerging compute equipment in a dielectric liquid, which boils to capture heat and then condenses to release it, significantly reducing space requirements and energy consumption. It cuts mechanical equipment energy use by 40%, CAPEX by 33%, TCO by 32%, and compacts data center white space by 69%. Additionally, it can save over 300 billion liters of water annually and repurpose heat for other applications.
Technology: The company's flagship technology includes two-phase immersion cooling, which offers superior thermal management by utilizing a passive cooling cycle. This involves the liquid coolant boiling as it absorbs heat from the servers, then condensing and releasing the heat outside the system.
Product Offering: LiquidStack's product range includes:
- DataTank™ Series: Modular immersion cooling tanks designed for various scale deployments, providing up to 252kW cooling capacity per rack.
- MicroModular™ and MacroModular™ Systems: These are prefabricated solutions that provide up to 1.5MW of cooling in modular formats, suitable for different operational scales.
Funding : Founded in 2012, Series B with $10M total funding amount
Advanced Dielectric Fluid Cooling
- Prevalence: Moderate and Growing
- Description: Enhanced dielectric fluids with better thermal properties for cooling sensitive electronic components.